A smart band-aid has been developed to speed up the healing process of chronic wounds. An important development work is underway. This smart band-aid focuses on slow-healing chronic wounds such as diabetic foot ulcers. As you can imagine, slow healing of a wound poses many risks. It is not easy to maintain an open wound, and such slow-healing wounds often leave people bedridden. Stanford University researchers, who have carried out an important study in this context, aim to make a difference in the lives of many people with the help of technology. The smart band-aid, the prototype of which you can see above, consists of two different layers. On top is a 100 micron thick polymer film that carries electronic components. On the underside of this film is a hydrogel that is in contact with the wound.
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Smart Band-Aid Makes a Splash
Biosensors on the product continuously monitor the electrical impedance and temperature of the underlying wound. According to the researches, the impedance value increases as the wounds heal and the temperature decreases as the inflammation decreases. The contents of this site and its linked pages may not be used, reproduced or modified, in whole or in part, without the written permission of LOG, even with reference or quotation.
If these measurements show that the wound is not healing fast enough, the electrical stimulator in the band-aid delivers a small electric current to the underlying tissue. This process is said to increase the speed at which skin cells migrate to the wound site, kill bacteria, accelerate tissue closure and reduce infection. The band-aid, which can connect wirelessly with smartphones, that is, can reveal the status of the wound from the phone application, can be easily separated from the wound if the hydrogel underneath is heated to 40 degrees.
It is not yet known when the band-aid, which will first be tested on mice, will be put into actual use. The contents of this site and its linked pages may not be used, reproduced or modified, in whole or in part, without the written permission of LOG, even with reference or quotation.
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